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铜尾矿作高速公路路面底基层性能试验研究与工程应用

Experimental Study on the Performance of Copper Tailings as the Subbase of Expressway Pavement and Its Engineering Application

  • 摘要: 为解决铜尾矿堆存带来的环境压力,并探索其在高速公路重交通等级路面底基层中的高值化利用路径,亟需明确铜尾矿的适宜掺量及配套胶结材料。通过配合比设计试验,研究了不同铜尾矿掺量下路面底基层材料的强度演变规律;以低水化热、高比表面积的钢铁渣复合料与传统水泥进行对比,评价胶结效果;依托实体工程开展工艺验证。研究发现,当铜尾矿掺量>30% 时,在相同胶结材料用量下材料强度显著衰减;采用钢铁渣复合料,能够提高强度,并降低路面底基层开裂的风险。综合考虑路用性能与经济成本,铜尾矿在底基层中的掺量宜控制在30% 以内,并以 SSCM 为优选胶结材料。由此形成的“铜尾矿–钢铁渣复合料”底基层成套施工技术已在实体工程中成功应用,验证了铜尾矿在高速公路路面结构中的高价值、高性能利用潜力。

     

    Abstract: This paper aims to explore the high-performance and high-value application of copper tailings in the base course of pavement, while reducing the utilization of natural aggregates and other resources. Through the study of the mix proportion design of copper tailings base course, the variation law of material strength of copper tailings base course under different copper tailings blending ratios was studied, and the suitable copper tailings blending ratio for the base course of pavement under heavy traffic and above grades of expressways was determined. Through the comparative study of the bonding effect of different binding materials on the copper tailings base course, the advantages of low hydration heat and high specific surface area steel slag composite materials as binding materials were clarified. Finally, combined with the implementation of the engineering entity, a complete set of construction technology for copper tailings base course was formed. The research found that when the blending ratio of copper tailings in the base course of pavement is too high, the performance will decline significantly under the same amount of binding materials. Considering the economy and road performance, the blending ratio should be controlled within 30%. The use of steel slag composite materials can improve the strength and reduce the risk of cracking in the base course of pavement. In the implementation of the engineering entity, copper tailings were successfully applied to the base course of expressway pavement, verifying its high-value and high-performance application effect.

     

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